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Introducing the HIROSE FH64MA Series, 0.25mm Pitch, Low Profile & Space Saving FPC Connector
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13 November 2019
Omron has launched a new touch operated sensor which can be used as a drop-in replacement for a traditional mechanical switch, but delivers all of the reliability and flexibility of touch.
30 October 2019
The STEF01 device from STMicroelectronics is a universal integrated programmable electronic fuse optimized for monitoring output current and the input voltage on DC power lines.
18 October 2019
Renesas has announced the expansion of its IDT ZWIRxx family with the introduction of the IDT ZWIR4532 wireless connectivity module, which is FCC certified and provides the critical and secure 6LoWPAN wireless connectivity to link devices to the Internet.
30 September 2019
Omron Electronic Components Business Europe has added a wide angle 32 x 32 element version of its D6T MEMS Thermal Sensors, offering the widest field of view that Omron has ever delivered.
22 September 2019
Building on the success of its popular G2RL series, Omron has now added an extra high capacity relay model to the family, the new G2RL-1A-E2 model is capable of handling switching currents up to 23A
12 September 2019
Bourns breakthrough GMOV component combines a Metal Oxide Varistor (MOV) and a Gas Discharge Tube (GDT) with their patented space-saving FLAT technology. This new hybrid product provides a compact form factor that is a drop-in replacement
22 August 2019
HIROSE, a world-class manufacturer in connectors, has extended the compact and low-profile DF60 series of robust Wire-to-Board and Wire-to-Wire connectors to meet the increased demand for high powered connectors offering advanced reliability.
SCHURTERS RTS thermal fuse is a particularly compact surface mount over temperature protection device for power semiconductors designed to meet the highest demands of modern electronics.
25 July 2019
The NCP series of NTC Thermistors from Murata are available in a wide range of resistance values and surface mount packages in 0201, 0402 and 0603 sizes.
In recent years Silicon Carbide (SiC) has emerged as one of the most viable candidates in the search for a next-generation, low-loss power semiconductor element due to its low ON resistance and superior high temperature, high frequency.
