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Anglia introduces the Plug-and-play STSPIN board for faster and smoother 3D printing from STMicroelectronics
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Lighting News from Anglia
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Calinar has launched a range of pin-fin heat sinks primarily designed to meet demanding LED cooling applications in the solid state lighting industry.
02 October 2018
Anglia has signed a distribution agreement with EFORE Plc to distribute its Digital Light range of programmable LED Drivers in the UK. EFORE Plc’s renowned Digital Light range supports a variety of LEDs and offer great programming opportunities.
01 October 2018
Littelfuse's range of thermally protected Surge Protective Devices are self-protected modules specially designed to be used in outdoor and commercial LED lighting fixtures for transient overvoltage protection.
Anglia is investing in the future of light with the addition of LG OLED, a world leader in OLED light technology to its successful and fast growing portfolio of OLED lighting solutions.
10 July 2018
The TMF300x series from Taicom have been designed to provide an array of mating options in both wire-to-wire and wire-to-board applications.
Cree has expanded the XLamp High Current LED Array family with new CMT LEDs that extend Cree's latest metal-based chip-on-board (COB) LED technology to the most prevalent COB form factors.
16 April 2018
Cree have expanded the J Series family of Mid Power lighting-class LEDs, the extended range opens up Cree's industry-leading portfolio of LEDs to a broader set of applications
12 September 2017
STMicroelectronics have created an STM32 Nucleo pack for LoRa™ technology utilising a high-performance FSK/OOK RF transceiver modem. The P-NUCLEO-LRWAN1 development tool allows engineers to learn and develop solutions based on LoRa™ and FSK/OOK.
01 September 2017
The drivers feature adjustable output currents of 0.1mA to 65mA (TSCR40 series) or 10mA to 300mA (TSCR42 series) and integrate the transistor, diodes and resistors into a single device which simplifies the system design by reducing component count.
The Soft-PGS material is ideal for applications where good thermal performance is critical such as interfacing high power IGBT modules to heatsinks.
